Application guide

Embedded RFID disc tags and labels for OEM products

Select an embedded transponder while the enclosure and assembly process can still accommodate it. Define the cavity, surrounding materials, reader position and exposure conditions. Approve a tag inside the finished assembly, with the final adhesive and nearby electronics in place.

Build the application specification

Project decisionWhat to defineWhat the sample must demonstrate
Mechanical integrationCavity dimensions, thickness allowance, fixing method and placement tolerance.Confirm fit without compression or interference during assembly.
Antenna environmentMetal, conductive surfaces, batteries, liquids and reader approach direction.Check reading through the final enclosure in intended orientations.
Assembly and serviceProcess temperature, pressure, chemicals and required operating conditions.Verify identification after assembly and representative service exposure.

Product configurations to discuss

These are catalog options for a specification discussion. Confirm suitability with your system provider and qualify the chosen product before production.

ICODE SLIX RXD00 transparent disc tag

A transparent PVC disc transponder for enclosure integration and compact identification assemblies. Diameters range from 13 to 50 mm, with optional adhesive backing. Select the diameter and IC together to meet antenna and installation requirements.

NTAG213 RXR00 white disc tag

A white PVC disc transponder available in 13, 15, 20, 25, 30 and 35 mm diameters. Full color artwork, printed numbering and optional adhesive backing support branded tags and identification assemblies.

Questions before ordering

Can the semiconductor temperature rating be used as the finished tag rating?

No. The antenna connection, enclosure, adhesive and assembly can impose different limits. Request the finished construction specification and the evidence required by your project.

What should accompany an OEM enquiry?

Send a drawing or dimensions, enclosure materials, reader and IC requirements, assembly conditions, intended volume and acceptance tests. Use nonconfidential sample data for the initial discussion.